紧缺

得益于高端数字芯片制造与新型人工智能产业的蓬勃兴起，掌握高精尖半导体封装测试工艺的核心技术人才变得极其紧缺。

dé yì yú gāo duān shù zì xīn piàn zhì zào yǔ xīn xíng rén gōng zhì néng chǎn yè de péng bó xīng qǐ, zhǎng wò gāo jīng jiān bàn dǎo tǐ fēng zhuāng cè shì gōng yì de hé xīn jì shù rén cái biàn dé jí qí jǐn quē.

Thanks to the boom in high-end digital chip manufacturing and new artificial intelligence industries, core technical talents who master high-precision semiconductor packaging and testing processes have become extremely scarce.